ASUS, Lenovo, TCL, And More Join MediaTek Wi-Fi 7 Lineup

MediaTek’s Wi-Fi 7 ecosystem is growing. According to the latest reports big companies including ASUS, Lenovo, TCL, BUFFALO, Hisense Video, Lumen, and TP-Link, etc. have all joined MediaTek Wi-Fi 7 ecology.

According to MediaTek Wi-Fi 7 chipset products include Filogic 880, Filogic 860, Filogic 380, and Filogic 360, with an addition of a comprehensive layout from flagship to mainstream markets.

After the introduction of Wi-Fi 6 MediaTek began to catch up and strived to achieve a lead in the Wi-Fi 7 era compared to Broadcom and Qualcomm.

In November 2023, MediaTek introduced the new Wi-Fi 7 processors Filogic 860 and Filogic 360 for mainstream devices, and the final products will be released in the middle of this year.

Filogic 860 Specs

• Filogic 860 is built on a 6nm process.
• Filogic 860 uses three Arm Cortex-A73 cores.
• It supports tri-band Wi-Fi 7.
• It  supports 4096-QAM.
• Filogic 860 integrates Bluetooth 5.4.
• Filogic 860 supports hybrid MLO, MRU, AFC, and other features.

Filogic 360 Specs

Filogic 360 is designed for smartphones, notebooks, and other devices. It supports

• Wi-Fi 7
• Bluetooth 5.4
• 2.4/5/6GHz tri-band wireless
• The antenna supports a 2T2R tri-band, with a peak rate of 2.9Gbps.

MediaTek Gets Large Orders From The Biggest American Laptop and Tablet Brand

Apart from the other brands, it is reported that MediaTek had won large orders for Wi-Fi 7 chips from the world’s leading American tablet brand, Intel laptop platform, and major mobile phone manufacturers.

This would also break Broadcom’s long-term monopoly on the Wi-Fi chip market.

Source (In Chinese)