On May 29th, at COMPUTEX 2019, MediaTek released a new 5G SoC. According to the official introduction, the MediaTek Helio M70 5G Chipset is based on the 7nm FinFET process and is the world’s first smartphone chip that uses ARM’s latest and fastest Cortex A77 CPU and Mali-G77 GPU.
More importantly, it integrates the Helio M70 5G modem ( Qualcomm is 5G supported by an external X50 or X55), with 4.7Gbps download speed and 2.5 Gbps upload speed, supporting 2G, 3G, 4G, 5G connectivity and dynamics. Power allocation to provide users with a seamless connection experience.
The official stressed that MediaTek 5G chipset released by MediaTek adopts the energy-saving design. This design is superior to the external 5G baseband chip solution, which can achieve higher transmission rate with lower power consumption.
Not only that, but it also uses a new AI architecture, equipped with a new independent AI processing unit APU, to support more advanced AI applications. This includes the image processing technology that eliminates image blur, even if the subject moves quickly, the user can still take a wonderful photo.
Chen Guangzhou, general manager of MediaTek, said that the industry, smartphone brand customers and consumers have high expectations for 5G. He further said:
We firmly believe that MediaTek’s 5G mobile platform will enable the 5G mobile platform to provide an unparalleled user experience with its superior architecture, leading image capabilities, powerful AI and ultra-high-speed 5G connection speed.
It is reported that MediaTek Helio M70 5G Chipset will deliver units to smartphone manufacturers in the third quarter of 2019. The first batch of 5G smartphones equipped with MediaTek 5G chipset will be available in the first quarter of 2020. The complete technical specifications of MediaTek’s 5G chip will be released in the coming months.
Source (in Chinese)