Xiaomi Civi 3

The upcoming Xiaomi’s Selfie King | The Civi 3 with MediaTek’s Dimensity 8200 Chip

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Leak Highlights

  • The Xiaomi Civi 3 will be equipped with the MediaTek Dimensity 8200 chip, marking the first time that the Xiaomi Civi series will be using the MediaTek platform.
  • The Dimensity 8200 chip uses TSMC’s new 4nm process and has a 1+3+4 architecture design. This advanced architecture is designed to provide maximum performance and energy efficiency.
  • The Xiaomi Civi 3 will have a focus on selfies, with the phone featuring 2 front cameras and a screen shape similar to the Civi 2.
  • The AnTuTu running score for the Dimensity 8200 is 900,000 points, indicating that the Xiaomi Civi 3 will be a powerful and fast phone.

According to recent news, blogger @WisdomPikachu has announced that the Xiaomi Civi 3 will be equipped with the MediaTek Dimensity 8200 chip. This marks the first time that the Xiaomi Civi series will be using the MediaTek platform, as previous models such as the Civi 2, Civi 1S, and Civi have all utilized the Snapdragon platform. This change in platform is a significant departure from the norm for Xiaomi, and it will be interesting to see how it affects the performance and features of the new phone.

It has been reported that the Dimensity 8200 chip uses TSMC’s new 4nm process and has a 1+ 3 + 4 architecture design. This design includes one A78 core with a main frequency of 3.1GHz and three A78 cores with a main frequency of 3.0GHz. This advanced architecture is designed to provide maximum performance and energy efficiency, making the Dimensity 8200 a powerful and efficient chip.

MediaTek

When compared to the Dimensity 8100 chip, the Dimensity 8200 has a slightly different composition for its large core, but the small core remains the same. Both chips have four energy-efficient A55 cores, with a main frequency of 2.0GHz. This ensures that the phone will have the power it needs for demanding tasks, while also being able to conserve energy when performing less intensive tasks. Additionally, the Dimensity 8200 uses the Mali-G610 MC6 GPU, which improves energy efficiency by 8%. This makes the phone more power-efficient, allowing for longer battery life and a more seamless user experience.

In terms of performance, the AnTuTu running score for the Dimensity 8200 is 900,000 points, which is significantly higher than that of the Dimensity 8100. This indicates that the Xiaomi Civi 3 will be a powerful and fast phone, capable of running demanding applications and games with ease.

Furthermore, the Xiaomi Civi 3 will also continue to have a strong focus on selfies. The phone will feature 2 front cameras and a screen shape similar to the Civi 2, which has a long strip-shaped hole resembling the “smart island” of the iPhone 14 Pro. This design allows for a larger screen-to-body ratio, providing a more immersive viewing experience, while also allowing for more discreet camera placement. With this combination of features, the Xiaomi Civi 3 is expected to be a strong contender for the title of “selfie king” in 2023.

Overall, the Xiaomi Civi 3 promises to be an impressive phone, with a powerful and efficient chip, advanced camera technology, and a sleek and modern design. It will be interesting to see how it compares to other smartphones in its class, and how it performs in the market.

Xiaomi Civi 3

Source ( Mydrivers, in Chinese )